Electrochemical Deposition Systems

Electrochemical deposition systems are specialized equipment used for plating and surface treatment in semiconductor manufacturing. These systems ensure precise layer deposition, boosting device performance and reliability.

  1. ACCEL CORP. SEMI-AUTOMATIC CENTRIFUGAL CLEANING SYSTEM

    Other Wet Process Equipment

    ACCEL CORP. SEMI-AUTOMATIC CENTRIFUGAL CLEANING SYSTEM

    Semi-Automatic Centrifugal Cleaning System Used for cleaning electronic assemblies Three step process.: Washing, rinsing, drying

    • Circuit assemblies
    • Precision parts
    • Medical devices
    • Bumper wafers
    • Flip chips , MCMs, BGAs, and hybrid circuits No drain or waste water treatment required Automatic recovery of solvents from waste water Four stage water purification process
  2. SEMITOOL SPRAY SOLVENT TOOL

    Other Wet Process Equipment

    SEMITOOL SPRAY SOLVENT TOOL

    Spray Solvent Tool Refurbished by Rhetech in 2000

    Photoresist develop/strip, polymer removal, pre-metal deposition cleaning. High speed rinse and dry of wafers, with low particle counts and reduced DI water consumption.

  3. Applied Materials Raider Edge ECD Liftoff Tool

    Other Wet Process Equipment

    Applied Materials Raider Edge ECD Liftoff Tool

    Applied Materials Raider Edge ECD Liftoff Tool

    • 3ea Process Tanks
    • 2ea Chemical Dispense Cabinets
    • HCl, Dilute HF, NH4OH, H2O2, Piranha & Chrome Etch
    • Please Inquire for Additional Details
  4. LUFRAN PROCESS TANK/HEATER/PROCESS CONTROLLER

    Other Wet Process Equipment

    LUFRAN PROCESS TANK/HEATER/PROCESS CONTROLLER

    Process Tank/Heater/Process Controller Compatible with sulphuric, nitric or acetic acids, various strippers even KOH and HF.

Common Applications

plating

surface treatment

semiconductor manufacturing

Buying Guide

Electrochemical Deposition Systems Buying Guide

When buying electrochemical deposition systems, especially surplus options, it's crucial to evaluate several factors to ensure high performance and compatibility with your manufacturing processes.

Consider aspects such as compatibility with your existing wafer sizes and handling systems, as well as the system's specific plating capabilities.

  • Verify the system's configuration and included components to ensure they meet your plating requirements.
  • Assess the condition and maintenance history to confirm reliability and performance.
  • Check for compatibility with 300mm wafers and other standards relevant to your operations.
  • Ensure that necessary documentation, like manuals, is available to facilitate integration and operation.

Frequently Asked Questions

What is the primary use of electrochemical deposition systems?
They are primarily used for plating and surface treatment in semiconductor manufacturing.
Which brands of electrochemical deposition systems are common?
Common brands include AMAT and DNS, as shown in the listings.
What should I consider when buying surplus electrochemical deposition systems?
Focus on configuration, condition, and compatibility with your existing equipment.
Are these systems compatible with 300mm wafers?
Yes, many systems like the AMAT RAIDER ECD310 support 300mm wafer processing.
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