Cleaning Systems

Cleaning systems are essential for maintaining contamination-free environments in semiconductor manufacturing. They ensure the reliable performance and longevity of critical components.

  2. CAI519 Canon FPA 3000 i5+

    Other Wafer Production Equipment

    CAI519 Canon FPA 3000 i5+

    Canon FPA 3000 i5+

    General Configuration:

    • FPA 3000 - i5(+)
    • Manufactured in  June / 1997
      • 8“ Wafer Chuck, Notch PA unit
      • 6“ Nikon-type Reticle Changer
      • Reticle Barcode-Reader =   yes
      • Cassette Barcode Reader = yes
      • Pellicle Particle Checker =   yes
      • Online - ESPA =   yes
      • Interface type:   right
      • Standard flys eye lens
      • Chamber type: CD80
  9. Scrap 3x mini buffers (10011500,10011501,10011502)

    Other Assembly / Hybrid

    Scrap 3x mini buffers (10011500,10011501,10011502)

    These 3 mini buffers (10011500,10011501,10011502) will be scrap because

    1: linked machines were already scrapped 

    2: function isn't complete

Popular Manufacturers

Applied Materials ASMPT AG Associates FUSEI Nitto fujiwa LAM Research Corp. Microcontrol ASYS Hanmi Semiconductor

Common Applications

Wafer cleaning

Substrate cleaning

Photomask cleaning

Contamination removal

Semiconductor manufacturing

Component maintenance

Buying Guide

Cleaning Systems Buying Guide

When selecting cleaning systems for semiconductor applications, it is vital to understand the specific needs of your manufacturing process. Ensure the system is compatible with the materials you regularly handle.

Consider the following when choosing a system:

  • Verify the system's compatibility with different substrates.
  • Check the available cleaning options and settings for versatility.
  • Assess the system's condition and any signs of wear.
  • Ensure necessary accessories and manuals are included for proper operation.

Frequently Asked Questions

What types of cleaning systems are available?
Available types include ultrasonic cleaning systems, wafer cleaning systems, and substrate cleaning systems.
How do ultrasonic cleaning systems work?
Ultrasonic cleaning systems use high-frequency sound waves to remove contaminants from surfaces.
What materials can be cleaned with these systems?
Materials such as wafers, substrates, and photomasks can be cleaned using these systems.
Are these systems suitable for semiconductor applications?
Yes, they are specifically designed for semiconductor applications, ensuring thorough cleanliness and operational efficiency.