Die Attach and Cleaning Systems

Die attach and cleaning systems are essential for the precise assembly and maintenance of semiconductor components. They enhance performance and reliability by ensuring clean surfaces and secure attachments.

  1. Scrap 3x mini buffers (10011500,10011501,10011502)

    Other Assembly / Hybrid

    Scrap 3x mini buffers (10011500,10011501,10011502)

    These 3 mini buffers (10011500,10011501,10011502) will be scrap because

    1: linked machines were already scrapped 

    2: function isn't complete

  2. AQUEOUS TECHNOLOGIES ULTRASONIC STENCIL CLEANING SYSTEM

    Other Assembly / Hybrid

    AQUEOUS TECHNOLOGIES ULTRASONIC STENCIL CLEANING SYSTEM

    Ultrasonic Stencil Cleaning System

    Make: Aqueous Technologies

    Model: Stencil Washer ECO

    1 unit @ Best Price

    Scotia, NY US

    Item 185858

  4. Die Sorter (Pick & Place)

    Other Assembly / Hybrid

    Die Sorter (Pick & Place)

    Transferring die from sawn wafer (mounted frame) to die plate or tape and reel.

    Location is at Infineon Penang.

  5. ULTRA T EQUIPMENT WAFER PHOTOMASK AND SUBSTRATE CLEANING SYSTEM

    Other Assembly / Hybrid

    ULTRA T EQUIPMENT WAFER PHOTOMASK AND SUBSTRATE CLEANING SYSTEM

    Manual Wafer, Photomask and Substrate Cleaning System

Common Applications

Semiconductor Assembly

Photomask Cleaning

Substrate Preparation

Die Bonding

Surface Maintenance

Buying Guide

Die Attach and Cleaning Systems Buying Guide

Choosing the right die attach and cleaning systems is critical for high-quality semiconductor production. These systems ensure that components are securely attached and free of contaminants.

Consider the following aspects when evaluating surplus equipment on the marketplace:

  • Verify the compatibility of die attach systems with your specific semiconductor components.
  • Check the condition of cleaning systems to ensure they meet cleanliness standards.
  • Ensure the equipment comes with necessary documentation and manuals for operation.
  • Evaluate if the systems offer the required precision and capabilities for your production needs.

Frequently Asked Questions

What is a die attacher?
A die attacher is a machine used in semiconductor manufacturing to securely attach semiconductor dies to substrates.
How does ultrasonic cleaning work?
Ultrasonic cleaning uses high-frequency sound waves to agitate a fluid, effectively cleaning items like photomasks or substrates.
Can these systems clean both wafers and substrates?
Yes, many cleaning systems are designed to handle both wafers and substrates with precision.
Why is cleaning important in semiconductor manufacturing?
Cleaning removes contaminants that can affect adhesion and electronic performance, ensuring high-quality semiconductor products.
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