Die Bonders

Die bonders are essential for attaching semiconductor dies to substrates with precision and stability. They enhance the reliability and efficiency of semiconductor assembly processes.

  1. SEMICONDUCTOR EQUIPMENT CORP WAFER FILM FRAME TAPE APPLICATOR

    Film/Wafer Mounters

    SEMICONDUCTOR EQUIPMENT CORP WAFER FILM FRAME TAPE APPLICATOR

    Wafer Film Frame Tape Applicator

    The item is sold AS IS without returns.

    For parts or not working condition. It is not tested. 

  5. MECH-EL EUTECTIC DIE BONDER

    Manual Eutectic Die Bonders

    MECH-EL EUTECTIC DIE BONDER

    The Mech-El/MEI 709 is a manual eutectic die attacher.  The machine comes with a  2 position slide table for die presentation and heated work holder.  The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.

  7. WEST-BOND ULTRASONIC WEDGE WIRE BONDER

    Manual Wedge Bonders

    WEST-BOND ULTRASONIC WEDGE WIRE BONDER

    Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation

    Representative photo

    Make: West-Bond

    Model: 7440A (formerly 7400IW)

    8 units @ Best Price

    Scotia, NY US

    Item 3897

  8. BESI Datacon 2200 evo plus Automatic Die Bonder

    Automatic Epoxy Die Bonders

    BESI Datacon 2200 evo plus Automatic Die Bonder

    BESI Datacon 2200 evo plus Automatic Die Bonder

    • Newer Used in Production
    • Die Attach, Flip Chip & Multi-Chip Capability
    • Upgraded Camera
    • Upgraded Image Processing Unit
    • Large Format Heated Stage 
    • Thermal Compensation
    • Open Platform Architecture
  11. WEST-BOND AUTOMATIC WEDGE BONDER

    Automatic Wedge Bonders

    WEST-BOND AUTOMATIC WEDGE BONDER

    Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically

Common Applications

Semiconductor Die Attachment

Substrate Bonding

Electronic Assembly

Buying Guide

Die Bonders Buying Guide

When selecting a die bonder, consider its compatibility with your specific manufacturing needs.

Evaluate the machine's configuration options and bonding technique to ensure it meets your production criteria.

  • Verify the bonding technology, such as eutectic or epoxy.
  • Assess the machine's condition and history for reliability.
  • Check for compatibility with your substrate materials.
  • Ensure all necessary documentation and manuals are included for proper operation.

Frequently Asked Questions

What is a die bonder?
A die bonder is a machine used to attach semiconductor dies to substrates with precision.
Why choose a surplus die bonder?
Surplus die bonders offer cost-effective solutions while maintaining high precision and reliability.
What types of die bonders are available?
Types include manual, automatic, and epoxy die bonders, each suited for different bonding needs.
Can die bonders handle various substrate materials?
Yes, die bonders are designed to work with a variety of substrates in semiconductor manufacturing.
\