2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.

Up to 300mm, Low-Volume Manufacturing, automated substrate handling

Brandnew and unsed System available for an attractive price!

Out of package Hyperion

Technical configuration:

• For maskless exposure of wafer sizes up to 300 mm

• High precision stage including contactless wedge error compensation

• Self calibration via integrated sensors

• Extensibility up to two (2) exposure heads in total for highest throughput

• Separate control unit

• EVG CIM Framework software

• Self diagnostics during machine start up, automatic initialization of all motors, position end switches, sensors and pneumatic

• Inspection available on request

• PC controlled operating environment

• Solid state drive and hard drive for high availability and reliability

• Supported layout format: GDSII