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Items from the following manufacturers are offered under Wafer Fabrication Equipment:
Absopulse Electronics Ltd.,
Acopian,
Advanced Energy,
AG Associates,
Airco Temescal,
Akrion,
AMAT,
AP&S Customized Solutions,
Applied Materials AKT,
Applied Materials, Inc.,
ASM,
ASML,
Astex,
Asyst Technologies,
Axcelis Technologies GmbH,
Axcelis/Eaton,
Branson/IPC,
Brooks Automation,
Bruce (BTI),
Canon,
CFM Technologies,
CHA Industries,
Cober,
Condor,
Daihen,
Dainippon Screen Mfg. Co., Ltd.,
DNS,
Dockweiler Chemicals,
E&R Engineering,
Electronic Measurements Inc,
ENI Power Systems,
EVG,
FSI,
Gasonics,
GCA/Precision Scientific,
Gerling,
Hamatech,
Headway,
Hewlett Packard,
Hitachi Kokusai Elec,
HNL Inc.,
Imtec Acculine,
Inficon,
InnerSense,
ITEC Powertron,
KLA-Tencor,
LAM Research Corp.,
Lambda,
Leatherwood Plastics,
Leybold,
Mactronix,
March Instruments,
Materials Research Corp,
Mattson Technology,
MKS Instruments, Inc.,
National Electronics,
Nexx Systems,
Nikon,
Nikon,
Oxford Instruments,
Plasma-finish Enterprise,
Plasma-Therm,
PlasmaQuest,
Power Ten Inc,
Power-One Inc,
Quintel,
RECIF,
Reynoldstech,
Sairem,
Semi-Tool,
SEMIgear,
Semitool,
Seren,
SEZ,
Silicon Valley Group,
SMC,
Solitec,
Sorensen,
Specialty Coating Systems,
Spectra Gases,
Speedfam,
Stackpole,
Surface Technology Systems,
Suss MicroTec,
Takatori,
Tamarack Scientific,
TDK-Lambda,
Technics,
Tel,
Telemark,
Temescal,
Tepla,
Terra Universal Inc.,
Tokyo Electron Limited,
Tokyo Electronics Limited,
Ulvac,
Unknown,
Varian,
Verteq,
Yield Engineering Systems
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