|Other Information |
Full model # 8126/36/8136/32
Up to 5" wafer
- Coat,bake,chill, receive and bottom edge bead removal
- Send,bake,chill,develop and receive
Wafers move from left to right on the photos
Photo resist track stations order: coating station, hot plate, chill plate.
Developer track stations order is: hot plate, chill plate, developer station-
configured for amplified photo resist with post exposure bake.
Tool configured for 3" wafer
Developer track demo video link icon is under the photo, if it does not play, click "pause" and then "play" again, please.
Demo video for coating track can be provided upon request.