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	View All Offers Under Semiconductor / Hybrid Assembly Equipment » Switch Major Category		Click an item's ID# below for its full specifications and source, or: Group Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment List all 51 product types under Semiconductor / Hybrid Assembly Equipment

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Displaying 1-100 of 120  Page    1  2

	Item ID	Photo	Short Description		Product Type / Details	#		Price	Notes	Location
			Make	Model
								$
	255419	ESEC	ESEC	2007 ESEC	Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacture 205940 2007 ESEC	1				Tijuana, Baja California
	255584	ESEC	ESEC	2007	Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 208424 2007 ESEC	1				Tijuana, Baja California
	255585	ESEC	ESEC	2007	Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 209377 2007 ESEC	1				Tijuana, Baja California
	255586	ESEC	ESEC	2007	Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 204882 2007 ESEC	1				Tijuana, Baja California
	255587	ESEC	ESEC	2007	Automatic Flip Chip Bonders in Flip Chip Bonders	1				Tijuana, Baja California
	255588	ESEC	ESEC	2007	Automatic Flip Chip Bonders in Flip Chip Bonders	1				Tijuana, Baja California
	256626	ESEC	ESEC	2007	Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: 2007 ESEC Die Bonder	1			N*	Tijuana, Baja California
	255416	fujiwa	fujiwa	250-70	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment 250-70 FUJIWA / Mold Press: Serial Number Model Manufacturer 2534 250-70 FUJIWA	1				Tijuana, Baja California
	255589	Orthodyne	Orthodyne	360C	Wire Bonding Equipment - Other in Wire Bonders 360C ORTHODYNE Wire Bonder: 360C ORTHODYNE Wire Bonder	1				Tijuana, Baja California
	256653	Orthodyne	Orthodyne	360C	Wire Bonding Equipment - Other in Wire Bonders 360C ORTHODYNE WIRE BONDER: 360C ORTHODYNE WIRE BONDER	1			N*	Tijuana, Baja California
	256655	hull	hull	4216LP-D	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment 4216LP-D HULL_FINMAC DEFLASH: 4216LP-D HULL_FINMAC DEFLASH	1			N*	Tijuana, Baja California
	197411	Adixen	Adixen	105842 or 105845	Helium Leak Detectors in Leak Detectors ADIXEN LEAK DETECTOR FILTER BODY: Adixen leak detector inlet filter body	3				Scotia, New York
	183220	Alcatel	Alcatel	ASM 180 TD	Helium Leak Detectors in Leak Detectors ALCATEL DRY HELIUM LEAK DETECTOR: Dry Helium Leak Detector	1			F*	Scotia, New York
	44813	Alcatel	Alcatel	ASM 180 TD	Helium Leak Detectors in Leak Detectors ALCATEL DRY HELIUM LEAK DETECTOR: Dry Helium Leak Detector	1				Scotia, New York
	160265	Alcatel	Alcatel	ASM-142-S	Helium Leak Detectors in Leak Detectors ALCATEL LEAK DETECTOR: Leak Detector	1				Scotia, New York
	3317	Alphasem	Alphasem	Swissline 9006	Automatic Epoxy Die Bonders in Epoxy Die Bonders Alphasem Swissline 9006: Automatic Epoxy Die Bonder	1			F*	Plano, TX
	207721	Miyachi Peco	Miyachi Peco	MG3 D W	Sealing/Welding Systems in Packaging Tools AMADA MIYACHI PECO WELD MONITOR: Weld Monitor for Resistance Spot Welding	1				Scotia, New York
	207686	Miyachi Unitek Corp.	Miyachi Unitek Corp.	IS-120B IT-1040-3	Sealing/Welding Systems in Packaging Tools AMADA MIYACHI UNITEK RESISTANCE SPOT WELDING SYSTEM 200A: Resistance Spot Welding System	1				Scotia, New York
	87402	Applied Materials	Applied Materials	0270-20059	Assembly Test Tools - Other in Assembly Test AMAT 0270-20059: 0270-20059 Calibration Tool-NEW	1				Plano, TX
	87401	Applied Materials	Applied Materials	0270-20083	Assembly Test Tools - Other in Assembly Test AMAT 0270-20083: 0270-20083 Calibration Tool-NEW	1			F*	Plano, TX
	185858	Aqueous Technologies	Aqueous Technologies	Stencil Washer ECO	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment AQUEOUS TECHNOLOGIES ULTRASONIC STENCIL CLEANING SYSTEM: Ultrasonic Stencil Cleaning System	1			F*	Scotia, New York
	255414	BESI	BESI	Datacon 2200 evo plus	Automatic Epoxy Die Bonders in Epoxy Die Bonders BESI Datacon 2200 evo plus Automatic Die Bonder: BESI Datacon 2200 evo plus Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage  Thermal Compensation Open Platform Architecture	1				Plano, Texas
	149618	Brooks Automation	Brooks Automation	Multitran 5	Robots in Assembly Robotics BROOKS AUTOMATION Multitran 5: 3 Axis Robot, Rebuilt	1			F*	Plano, TX
	256654	hull	hull	BT4216LP	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment BT4216LP HULL_FINMAC DEFLASH: BT4216LP HULL_FINMAC DEFLASH	1			N*	Tijuana, Baja California
	116597	Camalot	Camalot	1818	Dispensing/Coating Equipment in Packaging Tools CAMALOT/SPEEDLINE DISPENSING SYSTEM: Dispensing System Camalot/Speedline model 1818	1			F*	Scotia, New York
	92593	Dage Precision	Dage Precision	2400PC	Wire Bond Pull Testers in Assembly Test Dage 2400 PC Assembly Test Tool: Wire Pull/Ball Shear/Die Shear Tester	1			F*	Plano, TX
	94928	Dage Precision	Dage Precision	2400PC	Wire Bond Pull Testers in Assembly Test	1				Plano, TX
	119886	Dage Precision	Dage Precision	BT-23	Die Shear Testers in Assembly Test Dage BT-23: Die Shear Tester	1				Plano, TX
	152148	Dage Precision	Dage Precision	BT-23	Die Shear Testers in Assembly Test Dage BT-23 Series 23: Die Shear Tester	1				Plano, TX
	159005	Dage Precision	Dage Precision	BT23PC	Die Shear Testers in Assembly Test Dage BT23PC: Die Shear Tester	1				Plano, TX
	18432	Dage Precision	Dage Precision	BT24	Wire Bond Shear Testers in Assembly Test Dage BT24: Ball/Bump Shear Tester	1				Plano, TX
	64755	Dage Precision	Dage Precision	MCT 22	Wire Bond Pull Testers in Assembly Test Dage Microtester MCT 22: Microtester - Wire Bond Pull Tester	1				Plano, TX
	256629	Soft View Technology	Soft View Technology	SVDS	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Die Sorter (Pick & Place): Transferring die from sawn wafer (mounted frame) to die plate or tape and reel. Location is at Infineon Penang.	1			N*	George Town, Penang
	124317	Disco	Disco	DAD 320	Dicing Saws in Dicing Tools DISCO DICING SAW, 6": Dicing Saw Disco DAD 320	1			F*	Scotia, New York
	26420	Disco	Disco	DWT-13R Temp Controller	Dicing Saws in Dicing Tools DISCO DWT-13R: Water Temperature Controller	1				Scotia, New York
	53280	Dynatex	Dynatex	DX III	Diamond Scribers in Dicing Tools Dynatex DX III: Wafer Scriber/Breaker	1			F*	Plano, Texas
	33264	Edwards	Edwards	Spectron 5000	Helium Leak Detectors in Leak Detectors EDWARDS HELIUM LEAK DETECTOR: Helium Leak Detector Edwards Spectron 5000 Specify primary voltage 200VAC; 220VAC or 240VAC when ordering, please	3			F*	Scotia, New York
	3912	EFD	EFD	1000DV	Dispensing/Coating Equipment in Packaging Tools EFD 1000DV Fluid Dispenser: Fluid Dispenser	1		695.19		Scotia, New York
	3957	EFD	EFD	7000	Dispensing/Coating Equipment in Packaging Tools EFD 7000: Fluid Dispenser	7		620.17		Scotia, New York
	248130	EKRA	EKRA	Serio4000	Screen Printers in Semiconductor / Hybrid Assembly Equipment EKRA Serio 4000: Equipment for automated stencil printing  Designed for automated input and output Printing format min 80x50mm, max 510x510 Not suitable for manual loading and unloading	1				Regensburg, Bavaria
	625	Eppendorf	Eppendorf	5402	Centrifuges in Assembly Test EPPENDORF REFRIGERATED CENTRIFUGE: Refrigerated Centrifuge Eppendorf 5042	1			F*	Scotia, New York
	255417	ESEC	ESEC	ESEC 2007	Automatic Flip Chip Bonders in Flip Chip Bonders ESEC 2007 DIE BONDER: Serial Number Model Manufacturer 205940 2007 ESEC	1				Tijuana, Baja California
	119891	ESEC	ESEC	BL-050-N	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment ESEC BL-050-N: Die Attacher Loader	1				Plano, Texas
	119890	ESEC	ESEC	BU-050-N	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment ESEC BU-050-N: Die Attacher Unloader	1				Plano, Texas
	122185	ESEC	ESEC	Cat 2000	Automatic Eutectic Die Bonders in Eutectic Die Bonders ESEC Cat 2000: Die Attacher	3			F*	Plano, TX
	161528	F&K Delvotec	F&K Delvotec	5432	Automatic Wedge Bonders in Wedge Bonders F&K DELVOTEC AUTOMATIC WEDGE BONDER: Automatic Wedge Bonder	1			F*	Scotia, New York
	89751	Federal Mogul	Federal Mogul	1073-3/Spindle	Dicing Saws in Dicing Tools FEDERAL MOGUL 1073-3: Saw Spindle	1		5,001.34		Scotia, New York
	227967	Fisher Scientific	Fisher Scientific	accuSpin Micro 17R m/n 75002463	Centrifuges in Assembly Test FISHER SCIENTIFIC REFRIGERATED CENTRIFUGE 13300 RPM: Refrigerated Centrifuge	1				Scotia, New York
	256642	FUSEI	FUSEI	FMTM250-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI MOLD PRESS: FMTM250-7HS-32P FUSEI MOLD PRESS	1			N*	Tijuana, Baja California
	256643	FUSEI	FUSEI	FMTM250-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI MOLD PRESS: FMTM250-7HS-32P FUSEI MOLD PRESS	1			N*	Tijuana, Baja California
	256645	FUSEI	FUSEI	FMTM250-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS: FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS	1			N*	Tijuana, Baja California
	256649	FUSEI	FUSEI	FMTM300-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS	1			N*	Tijuana, Baja California
	256650	FUSEI	FUSEI	FMTM300-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS	1			N*	Tijuana, Baja California
	256651	FUSEI	FUSEI	FMTM300-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS	1			N*	Tijuana, Baja California
	256648	FUSEI	FUSEI	FMTM300-7HS-32P	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS: FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS	1			N*	Tijuana, Baja California
	235342	Gen 3 Systems	Gen 3 Systems	DC 2000 Nano Coat	Dispensing/Coating Equipment in Packaging Tools GEN 3 SYSTEMS PRECISION DIP COATER : Precision Dip Coater	1				Scotia, New York
	232225	Graco	Graco	TOFC-P20E24P3F	Dispensing/Coating Equipment in Packaging Tools GRACO HOT MELT BULK SYSTEM 20 LITER: New Surplus -- Never Installed Primary and Secondary Configuration for Constant Flow Applications.	3				Scotia, New York
	586	Hughes	Hughes	VTA90	Sealing/Welding Systems in Packaging Tools HUGHES PARALLEL GAP/OPPOSED WELD HEAD/POWER SUPPLY: Parallel Gap Opposed Weld Head with Power Supply	1				Scotia, New York
	10766	Hybond	Hybond	616-001	Outer Lead Bonders in TAB Bonders HYBOND 616-001: Ultrasonic Peg Bonder	1		8,252.21	F*	Scotia, New York
	43059	Hybond	Hybond	EDB 140A	Automatic Epoxy Die Bonders in Epoxy Die Bonders HYBOND SEMIAUTOMATIC EPOXY DIE BONDER: Semiautomatic Epoxy Die Bonder	1			F*	Scotia, New York
	181398	Intertest	Intertest	1014-CII/He	Pressurization Stations in Package Leak Testers INTERTEST HELIUM PRECONDITIONING SYSTEM: Dual Chamber Helium Preconditioning System for Hermetic Sealing	1			F*	Scotia, New York
	119894	Iwashita	Iwashita	Shotmatic 3	Dispensing/Coating Equipment in Packaging Tools Iwashita Shotmatic 3: Epoxy Dispenser	2				Plano, TX
	120256	Kulicke & Soffa	Kulicke & Soffa	1471	Automatic Wedge Bonders in Wedge Bonders K&S 1471: Automatic Wedge Bonder	2			F*	Plano, TX
	119896	Kulicke & Soffa	Kulicke & Soffa	1488 Plus	Automatic Ball Bonders in Ball Bonders K&S 1488 Plus: Automatic Gold Ball Bonder	1			F*	Plano, TX
	120257	Kulicke & Soffa	Kulicke & Soffa	6495	Automatic Epoxy Die Bonders in Epoxy Die Bonders K&S 6495: Semiautomatic Epoxy Die Bonder with PRS	1			F*	Plano, TX
	120258	Kulicke & Soffa	Kulicke & Soffa	6495	Automatic Epoxy Die Bonders in Epoxy Die Bonders K&S 6495: Semiautomatic Epoxy Die Bonder	1				Plano, TX
	64751	Kulicke & Soffa	Kulicke & Soffa	6496	Manual Flip Chip Bonders in Flip Chip Bonders K&S 6496 Die Bonder - Parts Tool Only: Semi-Automatic Hybrid Epoxy Die Bonder - PARTS TOOL ONLY	1			F*	Plano, TX
	120396	Kulicke & Soffa	Kulicke & Soffa	6497	Manual Flip Chip Bonders in Flip Chip Bonders K&S 6497: Semiautomatic Flip Chip Die Bonder	1			F*	Plano, TX
	89761	Kulicke & Soffa	Kulicke & Soffa	9388	Automatic Ball Bonders in Ball Bonders K&S 9388 LaserPro: Automatic Ball Attach System BGA/CSP	1				Plano, TX
	187773	Kulicke & Soffa	Kulicke & Soffa	971 MicroWash	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment K&S ULTRA T SAWED WAFER CLEANING SYSTEM: MicroWash Sawed Wafer Cleaning System High pressure de-ionized water spray cleaning system	1				Scotia, New York
	143258	Kulicke & Soffa	Kulicke & Soffa	4124	Manual Ball Bonders in Ball Bonders KULICKE & SOFFA K&S MANUAL BALL BONDER: Manual Ball Bonder	2			F*	Scotia, New York
	165163	Kulicke & Soffa	Kulicke & Soffa	4524D	Manual Ball Bonders in Ball Bonders KULICKE & SOFFA K&S MANUAL BALL BONDER: Manual Ball Bonder	1				Scotia, New York
	141132	Kulicke & Soffa	Kulicke & Soffa	4526	Manual Wedge Bonders in Wedge Bonders KULICKE & SOFFA K&S MANUAL WEDGE BONDER: Manual Wedge Bonder with Leica GZ6 Microscope	2			F*	Scotia, New York
	143256	Kulicke & Soffa	Kulicke & Soffa	4526	Manual Wedge Bonders in Wedge Bonders KULICKE & SOFFA K&S MANUAL WEDGE BONDER: Manual Wedge Bonder with Leica MZ6 Microscope	1			F*	Scotia, New York
	243867	Unknown	Unknown	Leak Testing Chamber	Helium Leak Detectors in Leak Detectors LEAK TESTING CHAMBER: Leak Chamber for He bomb testing Not for pressurizing samples	1			F*	Scotia, New York
	719	Leybold	Leybold	Ultratest F Probe	Helium Leak Detectors in Leak Detectors LEYBOLD QUICK TEST SNIFFING PROBE: Sniffing Probe	2		750.20		Scotia, New York
	84263	Loctite	Loctite	ZETA 1300	Dispensing/Coating Equipment in Packaging Tools LOCTITE ZETA 1300: Dispensing System	2		750.20		Scotia, New York
	126558	Longhill Industries	Longhill Industries	LH 832	Film/Wafer Mounters in Dicing Tools LONGHILL INDUSTRIES WAFER MOUNTER: Wafer Mounter Longhill Industries LH 832	1			F*	Scotia, New York
	189121	Mech-El	Mech-El	709	Manual Eutectic Die Bonders in Eutectic Die Bonders MECH-EL EUTECTIC DIE BONDER: The Mech-El/MEI 709 is a manual eutectic die attacher.  The machine comes with a  2 position slide table for die presentation and heated work holder.  The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.	1			F*	Scotia, New York
	153576	Micro Automation	Micro Automation	16744	Dicing Tools - Other in Dicing Tools Micro Automation 16744: Series 401 Dicing Wheel	1				Plano, TX
	127458	Micro Automation	Micro Automation	16744	Dicing Tools - Other in Dicing Tools Micro Automation 16744 Dicing Wheel: Dicing Wheel	62				Plano, TX
	229872	Micro Automation	Micro Automation	M-1100	Dicing Saws in Dicing Tools Microautomation M-1100 Wafer Dicing Saw: Microautomation M-1100 Wafer Dicing Saw	1				Plano, Texas
	38727	Microtech	Microtech	BT 30X5	Bubble Testers in Leak Detectors MICROTECH BUBBLE TESTER: Bubble Tester	1		3,650.98	F*	Scotia, New York
	41740	Minipack-Torre	Minipack-Torre	FM76	Sealing/Welding Systems in Packaging Tools Minipack-Torre FM76: Packaging Machine for Sealing and/or Shrinkwrapping	1				Plano, TX
	254740	Tazmo Co.,Ltd.	Tazmo Co.,Ltd.	Mounter 2 Glass	Film/Wafer Mounters in Dicing Tools	1				Villach, Kärnten
	1887	MPM	MPM	SP2400	Screen Printers in Semiconductor / Hybrid Assembly Equipment MPM CORPORATION SP2400: Screen Printer	1				Scotia, New York
	120401	MPM	MPM	SP-200	Screen Printers in Semiconductor / Hybrid Assembly Equipment MPM SP-200: Screen Printer, Semi-Automatic	1				Plano, TX
	100667	MULTIVAC	MULTIVAC	A 300/22	Packaging Tools - Other in Packaging Tools MULTIVAC VACUUM PACKAGE SEALING SYSTEM 450 MM: Vacuum Package Sealing System Multivac Model A 300/22	1		5,201.39		Scotia, New York
	221071	Nordson Asymtek	Nordson Asymtek	Spectrum S-820B	Dispensing/Coating Equipment in Packaging Tools NORDSON ASYMTEK PRECISION BATCH DISPENSING SYSTEM: Precision Batch Dispensing System	1				Scotia, New York
	235315	Scrap 3x mini buffers (10011500,10011501,10011502)	Scrap 3x mini buffers (10011500,10011501,10011502)		Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Scrap 3x mini buffers (10011500,10011501,10011502): These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped  2: function isn't complete	3			F*	Regensburg, Bavaria
	256639	fujiwa	fujiwa	SD250	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment SD250 FUJIWA MOLD PRESS: SD250 FUJIWA MOLD PRESS	1			N*	Tijuana, Baja California
	90336	Sealant Equipment En	Sealant Equipment En	See-Flo 690	Dispensing/Coating Equipment in Packaging Tools SEALANT EQUIPMENT & ENGINEERING DISPENSE SYSTEM: Positive Displacement Dispense System	1			F*	Scotia, New York
	127453	Semitec	Semitec	S1425	Dicing Tools - Other in Dicing Tools Semitec S1425 Dicing Wheels: Semitec PN 811-00-00-03-01	20				Plano, TX
	256630	Alphasem	Alphasem	SL9001	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Swissline Die Sorter (Pick & Place): Transferring die from sawn wafer (mounted frame) to tape and reel. Location is at Infineon Penang.	1			N*	George Town, Penang
	256344	Tazmo Co.,Ltd.	Tazmo Co.,Ltd.	Tazmo Mounter 4	Film/Wafer Mounters in Dicing Tools	1			N*	Villach, Carinthia
	83883	Telsonic	Telsonic	UPS-2500M	Sealing/Welding Systems in Packaging Tools TELSONIC ULTRASONIC WELDING SYSTEM: Ultrasonic Welding System Telsonic UPS-2500M	1				Scotia, New York
	127455	Tempress	Tempress	12467	Dicing Tools - Other in Dicing Tools Tempress 12467 Series 401 Dicing Wheel: Series 401 Dicing Wheel	190				Plano, TX
	153575	Tempress	Tempress	13741	Dicing Tools - Other in Dicing Tools Tempress 13741 Series 401 Dicing Wheel: Series 401 Dicing Wheel	1				Plano, TX
	256638	fujiwa	fujiwa	TEP-200-70	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-200-70 FUJIWA MOLD PRESS: TEP-200-70 FUJIWA MOLD PRESS	1			N*	Tijuana, Baja California
	257110	fujiwa	fujiwa	TEP-200-70	Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-200-70 FUJIWA MOLD PRESS: TEP-200-70 FUJIWA MOLD PRESS	1			N*	Tijuana, Baja California
Displaying 1-100 of 120  Page    1  2

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment: Adixen, Alcatel, Alphasem, Applied Materials, Inc., Aqueous Technologies, BESI, Brooks Automation, Camalot, Dage Precision, Disco, Dynatex, Edwards, EFD, EKRA, Eppendorf, ESEC, F&K Delvotec, Federal Mogul, Fisher Scientific, fujiwa, FUSEI, Gen 3 Systems, Graco, Hughes, hull finmac, Hybond, Intertest, Iwashita, Kulicke & Soffa, Leybold, Loctite, Longhill Industries, Mech-El, Micro Automation, Microtech, Minipack-Torre, Miyachi Peco, Miyachi Unitek Corporation, MPM, MULTIVAC, Nordson Asymtek, Orthodyne, Sealant Equipment Eng., Semitec, Soft View Technology, Tazmo Co.,Ltd., Telsonic, Tempress, Toman Tool Corporation, Towa, Ultra t Equipment, Ultron Systems Inc., Unitek, Unknown, Varian, Veeco Instruments, West-Bond, Yaskawa