About Us Contact Us Terms & Conditions
Serving  Our Guest Log in    Register to bid, list, and tradeHow to post your own listings   View prices in  or ...    
ALL CATEGORIES   Semi / Hybrid Assy   Die Bonders   Flip Chip Bonders    View    Search-by-Specs    Input    Edit    

FULL DESCRIPTION of Item 213293

in Automatic Flip Chip Bonders
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 213293

Offered 1 Offered at Best Price


ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

 

 

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch
  Click to see additional image(s)... other image

Location: Regensburg, Bavaria
Unit Price Unstated
Number of Units 1
Manufacturer ASM
Model Siplace CA4
Description SIPLACE CA4 incl. 4 Siplace Wafer Systems 8"
Accessories 

Vakuum Tooling Singletransport Chuck

Chiller Cooling System

Vacuumpump X-Series

Other Information 

Never used within serial production. Samples and product evaluation only.

Condition Excellent
Year of Manufacture 2014
CE Marked YES
Exterior Dimensions 
  Width 93.701  in  (238.0 cm)
  Depth 151.181  in  (384.0 cm)
  Height 73.228  in  (186.0 cm)
Weight 10,163  lb  (4,610 kg)
Shipping  Weight lb  kg 

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria