ITEM ID: 268342

DISCO DFS8960

Process: Grind

Planarisierer

Condition: very good

1 unit @ Best Price

MAKE: Disco

MODEL: DFS8960

CATEGORY: Other Semiconductor Manufacturing Equipment

SELLER: Infineon

Dresden, Germany

SPECS

Manufacturer Disco
Model DFS8960
Wafer Size Range
Minimum 300 mm
Maximum 300 mm
Condition Very Good
Year of Manufacture 2015
Exterior Dimensions
Width 55.118 in (140.0 cm)
Depth 130.709 in (332.0 cm)
Height 73.622 in (187.0 cm)
Weight 11,023 lb (5,000 kg)

S&H

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

Payment

100% downpayment