Other Information | Dispense Materials: Epoxy. Bonder is capable of doing conductive silver glass; option not included available from Hybond Bond Time Range: 7 to 15 seconds Bond Force Range: 15 to 50 grams Bondable Die Size Range: 6 x 6 mils (152 x 152 5m) to 750 x 750 mils (1,9 x 1,9 5m) Placement Accuracy: 1 1 mil (25,4 5m) standard Bond Line Accuracy: 1.0.5 mil (1m12,7 l5m) Bond Head Movement: Motorized, rotational, w/ fixed pick-up and placement points Bond Actuation: By opto-switch at fixed height. Cycle initiated by footswitch Z Axis Travel / Vertical Bonding Window: 0.5 in (1.20 cm) / 0.125 to 0.500 in. (0,31 to 1,20 cm) Table Motion: manual, with thumbscrew adjustments (standard) |