Other Information |
- Serial Number 516 Date of Manufacture: 5/93
- Volumetric Silver-Glass Dispense System With "Star Fish" Dispense Tool
- PGA, Cerdip, LCC and Side Brazed Packages
- Up to 200 mm (8") Wafers
- 0.25 – 18 mm (10 – 750 mil) Die Size
- 25 – 400 gr Pick/Bond Force
- 0 – 10 secs Bond Time
- 0.5 secs Cycle Time
- Programmable Pitch and Adjustable Boat Width of 2", 3.1" or 4.3" With Universal Roller-Boat Feed System
- Multi-magazine Input/Output
- Quick Lock Vacuum Chucks
- Cavity Depth Sensor for Automatic Adjustment of the Silver-Glass Bond Layer Thickness
- Inline Automatic Jumper Chip Attach Unit
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