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Flip Chip Bonders


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List all 2 product types under Flip Chip BondersList all 2 product types under Flip Chip Bonders


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 Offered (box) or Wanted (coins)  Item ID  Photo Short Description Product Type / Details # Price Notes Location
Make Model
  $  
213293
ASM  

ASM  

Siplace CA4 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:

SIPLACE CA4:

- High Volume Chip Assembly

- 4 Portal Microchip / SMD Hybrid Assembly system

- 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion

- 4 Wafer Transfer Systems 

- 4 LP-Kamera (TYP34) and bonding Head C+P20

- excluding Loader

 

 

1   Regensburg, Bavaria
64751
Kulicke & Soffa  

Kulicke & Soffa  

6496 

List all items of this typeManual Flip Chip Bonders

in Flip Chip Bonders

K&S 6496 Die Bonder - Parts Tool Only:
Semi-Automatic Hybrid Epoxy Die Bonder - PARTS TOOL ONLY
1   F* Plano, TX
120396
Kulicke & Soffa  

Kulicke & Soffa  

6497 

List all items of this typeManual Flip Chip Bonders

in Flip Chip Bonders

K&S 6497:
Semiautomatic Flip Chip Die Bonder
1   F* Plano, TX


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Flip Chip Bonders:
ASM, Kulicke & Soffa