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	View All Offers Under Semiconductor / Hybrid Assembly Equipment » Switch Major Category		Click an item's ID# below for its full specifications and source, or: Group Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment List all 51 product types under Semiconductor / Hybrid Assembly Equipment

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Displaying 101-109 of 109  Page    1  2

	Item ID	Photo	Short Description		Product Type / Details	#		Price	Notes	Location
			Make	Model
								$
	55707	West-Bond	West-Bond	8500	Automatic Wedge Bonders in Wedge Bonders WEST-BOND AUTOMATIC WEDGE BONDER: Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devices Bonds ultrasonically or thermosonically	1			F*	Scotia, New York
	181804	West-Bond	West-Bond	7600B	Manual Wedge Bonders in Wedge Bonders WEST-BOND MANUAL WEDGE BONDER: Manual Wedge Bonder	1				Scotia, New York
	172393	West-Bond	West-Bond	4500B	Manual Wedge Bonders in Wedge Bonders WEST-BOND SEMIAUTOMATIC WEDGE BONDER: Semi-Automatic Wedge Bonder Model 4500B operates under microprocessor control with user-programmed memory to stitch bond a succession of parallel multi-arch wires, requiring an operator only to position the critical bond target. Each increment of motion of tool and work in both Z and Y directions is chosen by stepper motors under program control so that the resulting wire connections have identical shapes. This is ideal for bonding high power, high frequency devices where it is necessary to hold the mutual inductance of parallel wires constant.	1				Scotia, New York
	3897	West-Bond	West-Bond	7440A (formerly 7400IW)	Manual Wedge Bonders in Wedge Bonders WEST-BOND ULTRASONIC WEDGE WIRE BONDER: Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices. Machine bonds insulated wire directly to thin film gold without the need to strip off insulation Representative photo	8			F*	Scotia, New York
	245208	ASM Technology Singa	ASM Technology Singa	Xpress GoCu	Wire Bonding Equipment - Other in Wire Bonders Wire bond ASM IHAWK XPRESS GOCU: Wire bond ASM IHAWK XPRESS GOCU with heat tunnel	1		0.00		Batam, Riau Islands
	245209	Shinkawa	Shinkawa	SKW_UTC2000	Wire Bonding Equipment - Other in Wire Bonders Wire Bond UTC2000: SW116:UTC2000:Gold wire bonder	1		0.00		Batam, Riau Islands
	245210	Shinkawa	Shinkawa	SKW_UTC2000	Wire Bonding Equipment - Other in Wire Bonders Wire Bond UTC2000: SW122:UTC2000:Gold wire bonder	1		0.00		Batam, Riau Islands
	245207	ASM	ASM	Xpress GoCu	Wire Bonding Equipment - Other in Wire Bonders Wire bond Xpress GoCu: Wire bond ASM i-Hawk Xpress Go Cu: Heat Tunnel	1		0.00		Batam, Riau Islands
	231102	Yaskawa	Yaskawa	MOTOMAN-MH12,DX200	Robots in Assembly Robotics YASKAWA MOTOMAN-MH12 SIX-AXIS ROBOT W/ DX200 ROBOT CONTROLLER: NEW SURPLUS, SIX-AXIS ROBOTIC SYSTEM Teach Pendant Not Included	1				Scotia, New York
Displaying 101-109 of 109  Page    1  2

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment: Adixen, Alcatel, Alphasem, Applied Materials, Inc., Aqueous Technologies, ASM, ASM Technology Singapore Pte Ltd, Brooks Automation, Camalot, Dage Precision, Disco, Dynatex, Edwards, EFD, EKRA, Eppendorf, ESEC, F&K Delvotec, Federal Mogul, Fisher Scientific, Gen 3 Systems, Graco, Hughes, Hybond, Intertest, Iwashita, Kulicke & Soffa, Leybold, Loctite, Longhill Industries, Mech-El, Micro Automation, Minipack-Torre, Miyachi Peco, Miyachi Unitek Corporation, MPM, MULTIVAC, NGK FILTECH, Nordson Asymtek, Sealant Equipment Eng., Semiconductor Equipment Corp, Semitec, Shinkawa, Telsonic, Tempress, Temptronic Corp, Thermex Thermatron, Tokyo Process Service, Toman Tool Corporation, Towa, Ultra t Equipment, Ultron Systems Inc., Unitek, Unknown, Uson, Vacuum Instrument Corporation, Varian, Veeco Instruments, Villa Precision Industries, West-Bond, Yaskawa