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FULL DESCRIPTION of Item 244705

in Other Wafer Production Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 244705

Offered 1 Offered at Best Price


Grinder DFG850 Disco 9

Fully automatic grinder

Grinder DFG850 Disco 9
  Click to see additional image(s)... other images

Location: Vienna, Vienna
Unit Price Unstated
Number of Units 1
Manufacturer Disco
Model DISCO9
Description Grinder
Wafer Size Range 
  Minimum 150 mm
  Maximum 200 mm
  Set Size 200 mm
Cassette to Cassette YES
Other Information 

Robot defect, rotating union Chuck B defect, Chuck A and Chuck C ok

Condition Poor
Year of Manufacture 2004
Power Requirements 200-208 V     50/60 Hz
CE Marked YES

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
IFAT FE PV PCS MNT LS
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria