Electrochemical Deposition Systems

Electrochemical deposition systems are specialized equipment used for plating and surface treatment in semiconductor manufacturing. These systems ensure precise layer deposition, boosting device performance and reliability.

  4. ACCEL CORP. SEMI-AUTOMATIC CENTRIFUGAL CLEANING SYSTEM

    Other Wet Process Equipment

    ACCEL CORP. SEMI-AUTOMATIC CENTRIFUGAL CLEANING SYSTEM

    Semi-Automatic Centrifugal Cleaning System Used for cleaning electronic assemblies Three step process.: Washing, rinsing, drying

    • Circuit assemblies
    • Precision parts
    • Medical devices
    • Bumper wafers
    • Flip chips , MCMs, BGAs, and hybrid circuits No drain or waste water treatment required Automatic recovery of solvents from waste water Four stage water purification process
  5. SEMITOOL SPRAY SOLVENT TOOL

    Other Wet Process Equipment

    SEMITOOL SPRAY SOLVENT TOOL

    Spray Solvent Tool Refurbished by Rhetech in 2000

    Photoresist develop/strip, polymer removal, pre-metal deposition cleaning. High speed rinse and dry of wafers, with low particle counts and reduced DI water consumption.

  8. SP203 (6'')

    Other Wet Process Equipment

    SP203 (6'')

    SP203 Mainunit: 6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8;

    3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3:

    Maintank; Chemistry Controller-Dos Wafer Size Range

    Minimum: 150 mm

    Maximum:150 mm

    Set Size: 150 mm

    Problems: Keyboard switching; voltage fluctuations; chemistry-cabinets heavily used; chemistry computer not original; modifications; FFU controller; 1 cabinet drain box repaired;

    • No Spare Parts available
    • dismantling date: We can dismantle the tool in May 2026 
    • Expected date of availability for the buyer: July 2026
  9. SP304 (8'')

    Other Wet Process Equipment

    SP304 (8'')

    SP304 Mainunit: The system is equipped with 8-inch Bernoulli handling, Frontside and Backside (implemented by PTW) with Pinlesschuck and Pinchuck; Cold DI in Nozzle; Hot DI in Dispenser; exhaust up; heat exchangers: 1x double hex with Lauda for Di, 1x double hex with Lauda for Medium 2; 1x single hex with Lauda for Medium 1 (not used), 1x single hex with Lauda for Medium 3;

    Chemistry: 2 cabinets with Maintank and Buffertank and with Mixtank with 3 Paddle wheels to fill and with Pressure regulator for the facility lines; with a Drainpumpstation.

    Problems: Chemistry cabinets are used; some parts in the tool are corroded; the tool has been repaired and converted to Bernoulli handling by PTW; software adjustments have been made.

    Wafer Size Range:

    Minimum: 200mm

    Maximun: 200mm

    Set Size: 200mm

    • No Spare Parts available
    • dismantling date: We can dismantle the tool in June 2026 
    • Expected date of availability for the buyer: August 2026
  10. Applied Materials Raider Edge ECD Liftoff Tool

    Other Wet Process Equipment

    Applied Materials Raider Edge ECD Liftoff Tool

    Applied Materials Raider Edge ECD Liftoff Tool

    • 3ea Process Tanks
    • 2ea Chemical Dispense Cabinets
    • HCl, Dilute HF, NH4OH, H2O2, Piranha & Chrome Etch
    • Please Inquire for Additional Details
  12. LUFRAN PROCESS TANK/HEATER/PROCESS CONTROLLER

    Other Wet Process Equipment

    LUFRAN PROCESS TANK/HEATER/PROCESS CONTROLLER

    Process Tank/Heater/Process Controller Compatible with sulphuric, nitric or acetic acids, various strippers even KOH and HF.

Common Applications

plating

surface treatment

semiconductor manufacturing

Buying Guide

Electrochemical Deposition Systems Buying Guide

When buying electrochemical deposition systems, especially surplus options, it's crucial to evaluate several factors to ensure high performance and compatibility with your manufacturing processes.

Consider aspects such as compatibility with your existing wafer sizes and handling systems, as well as the system's specific plating capabilities.

  • Verify the system's configuration and included components to ensure they meet your plating requirements.
  • Assess the condition and maintenance history to confirm reliability and performance.
  • Check for compatibility with 300mm wafers and other standards relevant to your operations.
  • Ensure that necessary documentation, like manuals, is available to facilitate integration and operation.

Frequently Asked Questions

What is the primary use of electrochemical deposition systems?
They are primarily used for plating and surface treatment in semiconductor manufacturing.
Which brands of electrochemical deposition systems are common?
Common brands include AMAT and DNS, as shown in the listings.
What should I consider when buying surplus electrochemical deposition systems?
Focus on configuration, condition, and compatibility with your existing equipment.
Are these systems compatible with 300mm wafers?
Yes, many systems like the AMAT RAIDER ECD310 support 300mm wafer processing.