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Other Wafer Fabrication Equipment


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Item IDPhotoItem DescriptionDescriptionSize RangeCass to Cass#PriceNotes Location
MakeModelSet Size
$
128244
286HT-8-10EPT13 8" Quartz Boat for 5 Wafers8" Quartz Boat for 5 Wafers9 Plano, TX
143185
Anelva 32-515-638Shutter Drive Unit2 Scotia, NY
148005
EVG 540Fully-Automated Production Wafer Bonder300 mm1 Scotia, New York
124309
EVG AB1-PVAnodic Wafer Bonder 1 Scotia, NY
71112
EVG EV640Wafer to Wafer Bond Aligner1 Scotia, NY
176359
EVG EVG850DB/200 Waferdebonder150 mmYES1 Regensburg, BY
176318 EVG EVG850TB/200 Waferbonder for 6 inch wafers150 mmYES1 Regensburg, BY
176319 EVG EVG850TB/200Waferbonder for 6 inch wafers150 mmYES1 Regensburg, BY
148001
EVG Smartview Bond Aligner300mm Wafer to Wafer Bond Aligner300 mm1 Scotia, NY
151338
Logitech BC1Wafer Bonder Controller1 Scotia, NY
181447
Logitech WSB2Wafer Substrate Bonding Unit100 mm1 F*Scotia, NY
187522
Reynoldstech CustomHot Plate, 200° C, 16" x 16", Vacuum Hold Down1 5,750.00 Scotia, NY
138230
Sharon Vacuum UnknownWafer Bonder1 9,500.00 Scotia, NY
189866 Takatori ATM-1100CTakatori ATM-1100C Automatic Wafer Taper200 mmYES1 N*Plano, Texas
189865 Takatori ATM-1100ETakatori ATM-1100E Wafer Taper200 mm1 N*Plano, Texas
189868 Takatori ATRM-2100Takatori ATRM-2100 Automatic Wafer Detaper200 mmYES1 N*Plano, Texas
189867 Takatori ATRM-2100DTakatori ATRM-2100D Automatic Wafer Detaper200 mmYES1 N*Plano, Texas

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Other Wafer Fabrication Equipment:
Anelva, EVG, Logitech, Reynoldstech, Sharon Vacuum , Takatori