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	View All Listings Under Die Bonders » Switch Major Category		Click an item's ID# below for its full specifications and source, or: Group Listings into sub-categories under Die Bonders List all 6 product types under Die Bonders

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Item ID  Photo Short Description Product Type / Details # Price Notes Location Make Model   $   3317 Alphasem   Alphasem   Swissline 9006  Automatic Epoxy Die Bonders in Epoxy Die Bonders Alphasem Swissline 9006: Automatic Epoxy Die Bonder 1   F* Plano, TX 213293 ASM   ASM   Siplace CA4  Automatic Flip Chip Bonders in Flip Chip Bonders ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch: SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems  - 4 LP-Kamera (TYP34) and bonding Head C+P20 - excluding Loader     1   Regensburg, Bavaria 122185 ESEC   ESEC   Cat 2000  Automatic Eutectic Die Bonders in Eutectic Die Bonders ESEC Cat 2000: Die Attacher 3   F* Plano, TX 43059 Hybond   Hybond   EDB 140A  Automatic Epoxy Die Bonders in Epoxy Die Bonders HYBOND SEMIAUTOMATIC EPOXY DIE BONDER: Semiautomatic Epoxy Die Bonder 1   F* Scotia, New York 120257 Kulicke & Soffa   Kulicke & Soffa   6495  Automatic Epoxy Die Bonders in Epoxy Die Bonders K&S 6495: Semiautomatic Epoxy Die Bonder with PRS 1   F* Plano, TX 120258 Kulicke & Soffa   Kulicke & Soffa   6495  Automatic Epoxy Die Bonders in Epoxy Die Bonders K&S 6495: Semiautomatic Epoxy Die Bonder 1   Plano, TX 64751 Kulicke & Soffa   Kulicke & Soffa   6496  Manual Flip Chip Bonders in Flip Chip Bonders K&S 6496 Die Bonder - Parts Tool Only: Semi-Automatic Hybrid Epoxy Die Bonder - PARTS TOOL ONLY 1   F* Plano, TX 120396 Kulicke & Soffa   Kulicke & Soffa   6497  Manual Flip Chip Bonders in Flip Chip Bonders K&S 6497: Semiautomatic Flip Chip Die Bonder 1   F* Plano, TX 189121 Mech-El   Mech-El   709  Manual Eutectic Die Bonders in Eutectic Die Bonders MECH-EL EUTECTIC DIE BONDER: The Mech-El/MEI 709 is a manual eutectic die attacher.  The machine comes with a  2 position slide table for die presentation and heated work holder.  The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform. 1   F* Scotia, New York 186724 West-Bond   West-Bond   7200A  Manual Epoxy Die Bonders in Epoxy Die Bonders West-Bond: West-Bond 7200A Manual Epoxy Die Bonder 1   Plano, TX

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Die Bonders: Alphasem, ASM, ESEC, Hybond, Kulicke & Soffa, Mech-El, West-Bond