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Semiconductor / Hybrid Assembly Equipment


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List all Offers under Semiconductor / Hybrid Assembly EquipmentList all 109 Offers under Semiconductor / Hybrid Assembly Equipment

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 Outer Lead Bonders  in TAB Bonders  (1)

 Packaging Tools - Other  in Packaging Tools  (1)

 Manual Eutectic Die Bonders  in Eutectic Die Bonders  (1)

 Manual Flip Chip Bonders  in Flip Chip Bonders  (2)

 Dispensing/Coating Equipment  in Packaging Tools  (9)

 Automatic Flip Chip Bonders  in Flip Chip Bonders  (1)

 Manual Wedge Bonders  in Wedge Bonders  (5)

 Film/Wafer Mounters  in Dicing Tools  (3)

 Automatic Wedge Bonders  in Wedge Bonders  (3)

 Manual Ball Bonders  in Ball Bonders  (2)

 Dicing Saws  in Dicing Tools  (5)

 Manual Epoxy Die Bonders  in Epoxy Die Bonders  (1)

 Automatic Ball Bonders  in Ball Bonders  (2)

 Centrifuges  in Assembly Test  (2)

 Dicing Tools - Other  in Dicing Tools  (6)

 Automatic Epoxy Die Bonders  in Epoxy Die Bonders  (4)

 Diamond Scribers  in Dicing Tools  (2)

 Die Shear Testers  in Assembly Test  (3)

 Automatic Eutectic Die Bonders  in Eutectic Die Bonders  (1)

 Wire Bond Pull Testers  in Assembly Test  (3)

 Screen Printers  in Semiconductor / Hybrid Assembly Equipment  (4)

 Helium Leak Detectors  in Leak Detectors  (13)

 Assembly / Hybrid - Other  in Semiconductor / Hybrid Assembly Equipment  (10)

 Wire Bond Shear Testers  in Assembly Test  (1)

 Sealing/Welding Systems  in Packaging Tools  (11)

 Injection Molding Presses  in Molding Presses  (2)

 Wire Bonding Equipment - Other  in Wire Bonders  (6)

 Assembly Test Tools - Other  in Assembly Test  (2)

 Pressurization Stations  in Package Leak Testers  (1)

 Robots  in Assembly Robotics  (2)

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment:
Adixen, Alcatel, Alphasem, Applied Materials, Inc., Aqueous Technologies, ASM, ASM Technology Singapore Pte Ltd, Brooks Automation, Camalot, Dage Precision, Disco, Dynatex, Edwards, EFD, EKRA, Eppendorf, ESEC, F&K Delvotec, Federal Mogul, Fisher Scientific, Gen 3 Systems, Graco, Hughes, Hybond, Intertest, Iwashita, Kulicke & Soffa, Leybold, Loctite, Longhill Industries, Mech-El, Micro Automation, Minipack-Torre, Miyachi Peco, Miyachi Unitek Corporation, MPM, MULTIVAC, NGK FILTECH, Nordson Asymtek, Oerlikon Leybold, Sealant Equipment Eng., Semiconductor Equipment Corp, Semitec, Shinkawa, Telsonic, Tempress, Temptronic Corp, Thermex Thermatron, Tokyo Process Service, Toman Tool Corporation, Towa, Ultra t Equipment, Ultron Systems Inc., Unitek, Unknown, Vacuum Instrument Corporation, Varian, Veeco Instruments, Villa Precision Industries, West-Bond, Yaskawa