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FULL DESCRIPTION of Item 245211

in Other Semiconductor Manufacturing Equipment 		Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 245211

Offered 1 Offered at Best Price


Die Bond Datacon 2200 evo

Model:EVO2200:Die Attach Bonder

 Die Bond Datacon 2200 evo

Location: Batam, Riau Islands
Unit Price $ 0.00
Number of Units 1
Manufacturer BESI
Model EVO2200
Other Information 

Power Supply : 230 VAC

Power Consumption : 2,3 KVA

Condition Good
Year of Manufacture 2007
Exterior Dimensions 
  Width 48.228  in  (122.5 cm)
  Height 68.898  in  (175.0 cm)
Weight 3,307  lb  (1,500 kg)

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria